SiGe BiCMOS Baseline Technology for More than Moore Functional Diversification
نویسنده
چکیده
“More Than Moore” functional diversification by combining different technologies is enlarging the spectrum for embedded system applications. In this paper we focus on the monolithic integration approach of optical components into the front-endoff-line (FEOL) to combine electronics and photonics (Si Photonics), and of MEMS (microelectro-mechanical systems) into the back-end-offline (BEOL) of SiGe BiCMOS technologies. Moreover the combination of InP and SiGe BiCMOS in an “on top of chip” wafer level process is discussed targeting on high frequency and making use of the potentially higher output power of the III-V semiconductor. This project is a joint activity with the FBH in Berlin, where the InP processing part is performed.
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